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The Mechanical Engineering Department of Harris Corporation has engaged
TDMG various times to provide thermal analysis for some of its Electronic
Products. TDMG always provides us with quality thermal analysis. They
respond fast to all our design changes and are keen to find a solution
that meets the specified operating temperature limits for our products,
what are in a very challenging environment.
TDMG proved to us that they are quite
capable of handling big assemblies with very good accuracy, including
small details. They also illustrated that they are experienced and quick
in sizing and optimizing the design of heat sinks (spacing, thickness,
orientation, shape, etc…).
We would gladly recommend TDMG to perform
any thermal analysis work. Harris would not hesitate in working with
TDMG in the future and we would be happy to provide further reference
should it be required.
Fathy Yowakim Ph. D., Eng
Manager, Mechanical Engineering Dept
Harris Corporation
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TDMG Inc. worked with Emerson Energy Systems to perform thermal &
outgassing analysis on a battery cabinet for the North American telecom
industry. This new cabinet is subjected to large temperature
extremes, sun loading and includes an active cooling/heating system.
The outgases exhausted by the batteries must also be evacuated in a
controlled fashion to prevent buildup and a potential explosion with the
ventilation on or off. With TDMG's inputs, Emerson was able to make
the correct tradeoffs to have an optimized system for heating, cooling and
outgassing of its new battery cabinet with minimal design cycling.
Giovanni Spinelli
EES Mechanical Design Engineer
Emerson Energy Systems- North America
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Hollister-Stier
Labs LLC required detailed airflow, temperature and humidity analysis to
support the design efforts for a pharmaceutical lyophilization (freeze
drying) processing area. The
new aseptic processing area includes a complex class 100 vial loading and
handling area which is surrounded by various rooms of different pressures.
TDMG’s experience and attention to detail provided critical information,
which played a vital role minimizing project costs and ultimate project
success.
Keith Bear
Senior Mechanical Engineer
Hollister-Stier
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Arrisphere engaged TDMG in August 2001 to provide thermal analysis and
product design required in the development of sophisticated electronic
equipment.
TDMG participated in a collaborated
effort with our staff in developing concepts and products for numerous
companies. TDMG has provided us with quality thermal analysis results
even under aggressive project schedules. Elements of the analysis
include system level air flow distribution, board level temperature
distribution and chip level junction temperature predictions. The
results provided were used to develop products that meet the operating
environment defined for each product. TDMG also provided product
development support, generating fabrication drawings for various
components of the product. We are very pleased with both the timeliness
and quality of the work performed by TDMG.
It is without hesitation that Arrisphere
recommends TDMG based on the work performed for our company. Arrisphere
would not hesitate in working with TDMG in the future, and would be
happy to provide further reference should it be required.
John Kim
Senior Partner
Arrisphere, LLC
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TDMG has provided thermal engineering consulting services to Flomerics
since 1999. During this time, Flomerics has been impressed by TDMG's
professionalism and thoroughness. We feel comfortable working with
TDMG and know that our customers will receive quality thermal engineering
services.
Andy Manning
Director of Engineering
Flomerics Inc.
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TDMG’s knowledge of heat transfer and use of analytical CFD tools has
helped Mintera manage thermal challenges and successfully prototype
designs on the first try.
From detailed component level modeling of IC’s and heat sinks to
overall chassis analysis, TMDG provides timely solutions that enable
design schedules to be minimized.
Scott Anderson,
Engineering Manager
Mechanical Engineering Dept
Mintera Corporation
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