Copyright © 2010 TDMG Inc.
All rights reserved.
(514) 381-
ENGINEERING ANALYSIS
THERMAL AND FLOW TESTING
In support of its extensive design and analysis capabilities, TDMG inaugurated its flow and thermal test lab in 2006. The lab, an 800 square foot facility, is to be used for flow testing and thermal characterization of electronic cooling and other general applications. TDMG’s windtunnel facility can generate flows up to 750 CFM. The lab contains state of the art pressure, temperature, and flow measurement devices and data logging equipment.
Whether it is to support to ongoing thermal analysis or carry out thermal validation work on existing prototypes, TDMG can perform this type of testing as needed. We can determine heatsink, card, and overall system pressure drop, as well as perform full flow and thermal characterization of cooling equipment or electronic systems. In various cases, we can also bring the lab to the customer site and perform testing on site.
If you have any questions regarding the above or for a specific design question which you may have, please contact us and we will be pleased to help you.
Click here to request additional information.
